The results are derived from a week-long study conducted by Sine Nomine Associates of Ashburn, Va., which examined the overall power consumption and external airflow requirements of a variety of blade server and 1U rack server configurations in a typical data centre environment experiencing light to heavy use.

The documented and publicly available results demonstrate that the HP BladeSystem c-Class and its zoned cooling properties not only lower power usage through efficient power distribution but also optimise airflow, which is a significant component in keeping data centres cool. In fact, the benchmark study shows the HP BladeSystem c-Class requires 60 per cent less airflow than the IBM BladeCenter-H. HP, the new industry leader in factory revenues and units shipped for blade servers, features HP Thermal Logic technology in its BladeSystem enclosure to offer customers reduced power and cooling loads right out of the box.

“Power and cooling are serious issues for customers,” said HP BladeSystem Division vice president Mark Potter. “Sine Nomine took an objective look at this real-world customer problem and the test results show what we already knew: HP BladeSystem c-Class featuring Thermal Logic is the clear choice for customers addressing their power and cooling challenges.”

Energy efficiency has been a key aspect of HP’s environmental strategy since 1992. The company offers a full range of energy-efficient products and enterprise solutions that help customers save money while reducing environmental impact.